1、Semiconductor devices Semiconductor interface forhuman body communicationPart 3: Functional type and its operational conditionsBS EN 62779-3:2016BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is the UK implementation of EN 6277
2、9-3:2016. It isidentical to IEC 62779-3:2016.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necess
3、ary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 86592 3ICS 31.080.01 Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was
4、published under the authority of theStandards Policy and Strategy Committee on 30 June 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62779-3:2016EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62779-3 June 2016 ICS 31.080.01 English Version Semicondu
5、ctor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (IEC 62779-3:2016) Dispositifs semiconducteurs - Interface semiconducteurs pour les communications via le corps humain - Partie 3: Type fonctionnel et ses conditions dutilisat
6、ion (IEC 62779-3:2016) Halbleiterbauelemente - Halbleiterschnittstelle zur Kommunikation ber den menschlichen Krper - Teil 3: Funktionstyp und seine Betriebsbedingungen (IEC 62779-3:2016) This European Standard was approved by CENELEC on 2016-05-31. CENELEC members are bound to comply with the CEN/C
7、ENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centr
8、e or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status
9、 as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
10、Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normu
11、ng CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 62779-3:2016 E BS EN 62779-3:2016EN 62779-3:2016 2 European foreword The text of document 47/2282/FDIS, future
12、edition 1 of IEC 62779-3, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62779-3:2016. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical n
13、ational standard or by endorsement (dop) 2017-02-28 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2019-05-31 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN
14、 shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62779-3:2016 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be ad
15、ded for the standard indicated : IEC 62779 NOTE Harmonized in EN 62779 series. BS EN 62779-3:2016 2 IEC 62779-3:2016 IEC 2016 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 6 2 Normative references. 6 3 Terms and definitions 6 3.1 Interface type 7 3.2 Detection of HBC interface 7 3.3 Electromagnetic
16、 field coupling . 7 3.4 Essential rating and characteristics 7 3.4.1 Signal transmission 7 3.4.2 Signal radiation 8 3.5 Other terms and definitions . 8 4 Interface type 9 4.1 General specifications . 9 4.1.1 Function 9 4.1.2 Implementation 10 4.1.3 Compatibility 10 4.2 Electrical specifications . 10
17、 4.2.1 Coupling specifications 10 4.2.2 Directional specifications 10 4.2.3 Transient specifications 11 4.3 Limiting values 11 4.3.1 Details to be stated 11 4.3.2 Electrical limiting values . 11 4.3.3 Temperatures 11 4.3.4 Humidity 11 Bibliography . 12 Figure 1 HBC interfaces . 6 Figure 2 Block diag
18、ram of interface 9 Table 1 Coupling specifications of a HBC interface . 10 Table 2 Direction specifications of a HBC interface . 11 Table 3 Transient specifications of a HBC electrode . 11 BS EN 62779-3:2016IEC 62779-3:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES
19、 SEMICONDUCTOR INTERFACE FOR HUMAN BODY COMMUNICATION Part 3: Functional type and its operational conditions FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees).
20、The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Spec
21、ifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organization
22、s liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters
23、express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Co
24、mmittees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC Nat
25、ional Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself doe
26、s not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they ha
27、ve the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whats
28、oever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publica
29、tions is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Stand
30、ard IEC 62779-3 has been prepared by IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47/2282/FDIS 47/2292/RVD Full information on the voting for the approval of this standard can be found in the report on voting
31、indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. BS EN 62779-3:2016 4 IEC 62779-3:2016 IEC 2016 A list of all parts in the IEC 62779 series, published under the general title Semiconductor devices Semiconductor interface for human bod
32、y communication, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication w
33、ill be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this docum
34、ent using a colour printer. BS EN 62779-3:2016IEC 62779-3:2016 IEC 2016 5 INTRODUCTION The IEC 62779 series is composed of three parts as follows: IEC 62779-1 defines general requirements of a semiconductor interface for human body communication. It includes general and functional specifications of
35、the interface. IEC 62779-2 defines a measurement method on electrical performances of an electrode that constructs a semiconductor interface for human body communication. IEC 62779-3 defines functional type of a semiconductor interface for human body communication, and operational conditions of the
36、interface. IEC 60748-4 gives requirements on interface integrated circuits for semiconductor devices. Especially, Chapter III, Section 7 in this standard is applied to interface circuits for a communication network using a general channel, such as wire or wireless. However, a channel for HBC is the
37、human body whose channel properties, such as signal loss and delay profile, are different from the general channel, so the Chapter III, Section 7 cannot be applied to an interface for HBC. Furthermore, a standard on a communication protocol for body area network (BAN) IEEE 802.15.6 (IEEE Std 802.15.
38、6-2012), which includes a communication protocol for HBC was published in 2012. A common interface for HBC should be defined to secure communication compatibility between various devices that are implemented on/inside the human body or embedded in peripheral equipments. BS EN 62779-3:2016 6 IEC 6277
39、9-3:2016 IEC 2016 SEMICONDUCTOR DEVICES SEMICONDUCTOR INTERFACE FOR HUMAN BODY COMMUNICATION Part 3: Functional type and its operational conditions 1 Scope This part of IEC 62779 series defines a functional type of a semiconductor interface for human body communication (HBC). An interface for HBC in
40、cludes an electrode that is physical structure to transmit a data signal to the human body or receive a transmitted data signal from the body. An electrode directly contacts with the human body in many cases, but it cannot maintain the contact condition when an object, such as clothes, exists betwee
41、n the interface and the body or a near field communication is required; hence, depending on the contact condition, an interface for HBC can be categorized into a contact and non-contact type as shown in Figure 1. This part includes the categorization of the interface for HBC according to the contact
42、 condition; and performance parameters characterizing the interface of each category. a) contact type b) non-contact type Key Human Body Human body of a user using HBC Electrode Physical structure to transmit an electrical signal to the human body or receive a signal from the human body Figure 1 HBC
43、 interfaces 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (includi
44、ng any amendments) applies. None. 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. IEC Interface Human body Weak electric field Electrode IEC Interface Human body Strong electric field Electrode BS EN 62779-3:2016IEC 62779-3:2016 IEC 2016 7 3.1 In
45、terface type 3.1.1 contact-type HBC interface HBC interface whose electrode has a physical contact with the human body Note 1 to entry: A contact-type HBC interface generates a strong electromagnetic field which is coupled with the human body through an electrode because a physical contact by an ele
46、ctrode causes a decrease in load impedance of the interface and an increase in output current accordingly. Note 2 to entry: This note applies to the French language only. 3.1.2 noncontact-type HBC interface HBC interface whose electrode does not have a physical contact with the human body Note 1 to
47、entry: Unlike a contact-type HBC interface, a noncontact-type HBC interface generates a weak electromagnetic field through the electrode, in which the field is coupled with the human body through an electrode and an object located between the human body and an electrode. Note 2 to entry: This note a
48、pplies to the French language only. 3.2 Detection of HBC interface 3.2.1 contact detection detection process that determines whether an electrode has a physical contact with the human body or not in the case of a contact-type HBC interface 3.2.2 proximity detection detection process that determines
49、whether an electrode is within a specific distance from the human body or not in the case of a noncontact-type HBC interface 3.3 Electromagnetic field coupling 3.3.1 field coupling coupling with the human body of an electromagnetic field generated from a HBC interface Note 1 to entry: Depending on a frequency of a signal to be transmitted or received, an electric or magnetic field is involved in the field coupling. 3.3.2 directional coupling field coupling whose amount i
