1、 IEC 61760-3Edition 1.0 2010-03INTERNATIONAL STANDARD NORME INTERNATIONALESurface mounting technology Part 3: Standard method for the specification of components for through hole reflow (THR) soldering Technique du montage en surface Partie 3: Mthode normalise relative la spcification des composants
2、 pour le brasage par refusion trous traversants (THR, Through Hole Reflow) IEC61760-3:2010 colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2010 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any for
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16、er des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 61760-3Edition 1.0 2010-03INTERNATIONAL STANDARD NORME INTERNATIONALESurface mounting technology Part 3: Stan
17、dard method for the specification of components for through hole reflow (THR) soldering Technique du montage en surface Partie 3: Mthode normalise relative la spcification des composants pour le brasage par refusion trous traversants (THR, Through Hole Reflow) INTERNATIONAL ELECTROTECHNICAL COMMISSI
18、ON COMMISSION ELECTROTECHNIQUE INTERNATIONALE SICS 31.190 PRICE CODECODE PRIXISBN 2-8318-1083-9 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale colourinside 2 61760-3 IEC:2010 CONTENTS FOREWORD.4 1 Scope and object6
19、2 Normative references .6 3 Terms and definitions .7 4 Requirements to component design and component specifications.8 4.1 General requirement .8 4.2 Packaging .8 4.3 Labelling of product packaging 9 4.4 Component marking 9 4.5 Storage and transportation 10 4.6 Component outline and design 10 4.6.1
20、Drawing and specification10 4.6.2 Pick-up area requirements.10 4.6.3 Bottom surface requirements.10 4.6.4 Requirements to terminals.10 4.6.5 Component height .14 4.6.6 Component weight.14 4.7 Mechanical stress .14 4.8 Component reliability.14 4.9 Additional requirements for compatibility with lead-f
21、ree soldering 15 5 Specification of assembly process conditions .15 5.1 Mounting by soldering .15 5.2 Reflow soldering methods (recommended) 16 5.2.1 Vapour phase reflow soldering.16 5.2.2 Forced air convection reflow soldering.16 5.3 Cleaning (where applicable) 17 5.3.1 General .17 5.3.2 Fluid 17 5
22、3.3 Ultrasonic cleaning 17 5.3.4 Vapour 17 5.3.5 Spray.17 5.3.6 Plasma cleaning 17 5.4 Removal and/or replacement.17 5.4.1 Removal and/or replacement of soldered components .17 6 Typical process conditions18 6.1 Printing of solder paste .18 6.2 Component insertion .18 6.3 Soldering processes, tempe
23、rature/time profiles .18 6.3.1 Vapour phase soldering.19 6.3.2 Forced gas convection reflow soldering .20 6.4 Typical cleaning conditions for assemblies 21 6.5 Inspection of solder joints21 7 Requirements for components and component specifications for THR soldering processes.21 7.1 General .21 7.2
24、Wettability .21 61760-3 IEC:2010 3 7.3 Dewetting22 7.4 Resistance to soldering heat .22 7.5 Resistance to cleaning solvent 22 7.5.1 Solvent resistance of component .22 7.5.2 Solvent resistance of marking22 7.6 Soldering profiles 22 7.7 Moisture sensitivity level (MSL) .22 Figure 1 Example of a compo
25、nent with marked specific orientation put in tape and tray.9 Figure 2 Example of components in a tape.9 Figure 3 Examples for clearances (stand-off) .10 Figure 4 Examples for terminal shapes and position tolerances .12 Figure 5 Schematic example of contrast of bottom surface terminals underneath com
26、ponent body .13 Figure 6 Schematic example of contrast of bottom surface terminals outside component body .13 Figure 7 Component weight / pipette suction strength 14 Figure 8 Process steps for soldering 15 Figure 9 Examples for printing of solder paste .18 Figure 10 SnPb Vapour phase soldering tempe
27、rature/time profile (terminal temperature).19 Figure 11 Lead-free SnAgCu Vapour phase soldering temperature/time profile (terminal temperature) 19 Figure 12 Forced gas convection reflow soldering temperature/time profile for SnPb solders 20 Figure 13 Forced gas convection reflow soldering temperatur
28、e/time profile for lead-free SnAgCu solders.20 Table 1 Basic cleaning processes 21 4 61760-3 IEC:2010 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY Part 3: Standard method for the specification of components for through hole reflow (THR) soldering FOREWORD 1) The Internatio
29、nal Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic
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38、 upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the eleme
39、nts of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61760-3 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on
40、 the following documents: CDV Report on voting 91/856/CDV 91/898/RVC Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all
41、parts of the IEC 61760 series, under the general title Surface mounting technology can be found on the IEC website. 61760-3 IEC:2010 5 The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.ie
42、c.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful
43、for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 61760-3 IEC:2010 SURFACE MOUNTING TECHNOLOGY Part 3: Standard method for the specification of components for through hole reflow (THR) soldering 1 Scope and object This part of IEC 617
44、60 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads inte
45、nded for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is inte
46、nded. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated refe
47、rences, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60062, Marking codes for resistors and capacitors IEC 60068 (all parts), Environmental testing IEC 60068-2-20, Environmental testing Part 2-20: Tests
48、Test T: Test methods for solderability and resistance to soldering heat of devices with leads IEC 60068-2-21, Environmental testing Part 2-21: Tests Test U: Robustness of terminations and integral mounting devices IEC 60068-2-45:1980, Basic environmental testing procedures Part 2-45: Tests Test XA a
49、nd guidance: Immersion in cleaning solvents Amendment 1:1993 IEC 60068-2-58, Environmental testing Part 2-58: Tests Test Td: Test methods for solderability resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-77, Environmental testing Part 2-77: Tests Body strength and impact shock IEC 60068-2-82, Envir
