1、 IEC/TR 62258-4 Edition 2.0 2012-08 TECHNICAL REPORT RAPPORT TECHNIQUE Semiconductor die products Part 4: Questionnaire for die users and suppliers Produits de puces de semiconducteurs Partie 4: Questionnaire destin aux utilisateurs et fournisseurs de puces IEC/TR62258-4:2012 THIS PUBLICATION IS COP
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16、ctor die products Part 4: Questionnaire for die users and suppliers Produits de puces de semiconducteurs Partie 4: Questionnaire destin aux utilisateurs et fournisseurs de puces INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE R ICS 31.080.99 PRICE CODE CODE PRIX
17、ISBN 978-2-83220-297-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette
18、 publication via un distributeur agr. 2 TR 62258-4 IEC:2012 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope . 6 2 Normative references . 6 3 Terms and definitions . 6 4 General 6 5 Data exchange . 7 Annex A (normative) Customer questionnaire on die devices . 8 Bibliography 18 Table A.1 Basic data 9 T
19、able A.2 Bare die and wafers . 10 Table A.3 Die and wafers with connection structures . 11 Table A.4 Minimally-packaged die devices . 12 Table A.5 Quality, reliability and storage 12 Table A.6 Terminal data . 14 Table A.7 Terminal geometries 14 Table A.8 Polygon vertices 15 Table A.9 Fiducial defini
20、tions . 15 Table A.10 Fiducial positions . 16 Table A.11 Simulator data 16 Table A.12 Group definitions 17 Table A.13 Permutations 17 TR 62258-4 IEC:2012 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DIE PRODUCTS Part 4: Questionnaire for die users and suppliers FOREWORD 1) The Interna
21、tional Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electro
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30、nce upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the el
31、ements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. However, a technical committee may propose the publication of a techni
32、cal report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC 62258-4, which is a technical report, has been prepared by IEC technical committee 47: Semiconductor devices. This technical report contai
33、ns attached files in the form of 47-62258-4-TR-E-worksheet.xls. These files are intended to be used as a complement and do not form an integral part of the technical report. This second edition cancels and replaces the first edition published in 2007 and constitutes a technical revision. This editio
34、n includes the following significant technical changes with respect to the previous edition: 4 TR 62258-4 IEC:2012 The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly. The text of this technical report is based on the following documents: Enquiry draft Report on voting
35、 47/2073A/DTR 47/2108/RVC Full information on the voting for the approval of this technical report can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 62258 series,
36、published under the general title Semiconductor die products, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specifi
37、c publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. TR 62258-4 IEC:2012 5 INTRODUCTION This technical report is based on the work carried out in the ESPRIT 4th Framework Project GOODDIE which resulted in the publication of the ES 59
38、008 series of European specifications. Organizations that helped prepare this document included the ESPRIT ENCAST and ENCASIT projects, the Die Products Consortium, JEITA, JEDEC and ZVEI. 6 TR 62258-4 IEC:2012 SEMICONDUCTOR DIE PRODUCTS Part 4: Questionnaire for die users and suppliers 1 Scope This
39、part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This technical report contains a questionna
40、ire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC
41、 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information
42、requested herein. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (i
43、ncluding any amendments) applies. IEC 60050 (all parts), International Electrotechnical Vocabulary (available at http:/www.electropedia.org) IEC 62258-1:2009, Semiconductor die products Part 1: Procurement and use IEC 62258-2:2011 Semiconductor die products Part 2: Exchange data formats 3 Terms and
44、definitions For the purposes of this document, the terms and definitions given in the IEC 60050 series and IEC 62258-2:2011 apply. 4 General To comply with IEC 62258-1:2009, that standard requires that suppliers of die devices furnish information which is necessary and sufficient for users of the de
45、vices at all stages of design, procurement, manufacture and test of the products containing them. The questionnaire in Annex A provides a pro forma that can form a standard basis for supplying such information and is intended as an aid to compliance with the standard. TR 62258-4 IEC:2012 7 Where ref
46、erences are made in this technical report to clauses in IEC 62258-1:2009 and IEC 62258-2:2011, they apply to those editions only. The tables in the annexes contain requirements for information that is not yet covered by those parts of the standard but which will be included in future issues. Further
47、more, some of the terminology may not be exactly in accordance with those standards. For example, the term “pad” is replaced by “terminal” in this technical report. Whilst it is expected that much of the information supplied will be in the public domain and available from such sources as manufacture
48、rs data sheets, neither the standard nor the questionnaire places an obligation on a supplier to make information public. Any information that a supplier considers to be proprietary or commercially sensitive may be supplied under the terms of a non-disclosure agreement. 5 Data exchange In conjunctio
49、n with the questionnaire tables in Annex A, a spreadsheet is available which allows the information to be supplied electronically. Use of the spreadsheet (47-62258-4-TR-E-worksheet.xls) will also enable computer-sensible descriptions of die devices to be generated that can then be converted to the DDX format as defined in IEC 62258-2:2011, the XML format compliant with the schema in IEC 62258-7, the EXPRESS mo
