1、 IEC/TR 62658 Edition 1.0 2013-07 TECHNICAL REPORT Roadmap of optical circuit boards and their related packaging technologies IEC/TR 62658:2013(E) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of
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10、C:2013(E) CONTENTS FOREWORD . 3 1 Scope . 5 2 General 5 2.1 Background of optical packaging technology road map 5 2.2 Advantages of optical interconnects 7 2.3 Planar embedded optical waveguides 9 3 Standardization of board-level optical packaging 9 3.1 Role of IEC TC86/JWG9 (with TC91) . 9 3.2 Opti
11、cal circuit boards 20 10 3.3 Optical backplanes 22 . 11 3.4 Optical circuit board connectors 23 13 3.5 Opto-electronic modules on boards . 14 3.6 Originating standards 15 4 Standardization road map . 16 4.1 Performance trends for optical circuit boards . 16 5 Standardization road map of optical circ
12、uit boards 17 Bibliography 18 Figure 1 Data transmission speed and capability trends for network traffic and server systems 2. 6 Figure 2 Internet traffic and router power consumption in Japan 5 . 7 Figure 3 Increase of power consumption in future network . 8 Figure 4 Comparison of power consumption
13、 of 10 Tbps electrical and optical routers . 9 Figure 5 Discussion field in IEC TC86/JWG9 (with TC91) 10 Figure 6 Classification of optical circuit boards 11 Figure 7 Four types of optical backplane applications 13 Figure 8 Classification of optical circuit board connectors 14 Figure 9 Classificatio
14、n of optical modules on boards 15 Figure 10 De facto-standards in Japan 24 15 Figure 11 Performance trends for optical circuit boards 16 Figure 12 Standardization roadmap of optical circuit board and its related optical packaging . 17 TR 62658 IEC:2013(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION
15、 ROADMAP OF OPTICAL CIRCUIT BOARDS AND THEIR RELATED PACKAGING TECHNOLOGIES FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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27、as been prepared by IEC technical committee 86: Fibre optics. The text of this technical report is based on the following documents: Enquiry draft Report on voting 86/442/DTR 86/453/RVC Full information on the voting for the approval of this technical report can be found in the report on voting indi
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29、ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication
30、 indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. TR 62658 IEC:2013(E) 5 ROADMAP OF OPTICAL CIRCUIT BOARDS AND THEIR RELATED PACKAGING TECHNOLOGIES 1 Scope This Techn
31、ical Report covers the roadmap of optical circuit boards, and its related packaging technologies including optical circuit board connectors and optical modules on boards. 2 General 2.1 Background of optical packaging technology road map The volume of network traffic is dramatically increasing due to
32、 the amount of data being captured, processed, conveyed and stored as digital information. This information is generated from many sources, including critical business applications, email communications, the Internet and multimedia applications which have collectively fuelled an increase in demand f
33、or data networking and storage capacity. In addition, the proliferation of media rich applications, such as digital music and video sharing services is fuelling a concurrent increase in data processing in data centres 1 1 . The growth in network traffic attributed to personalized content is 20 % per
34、 month, giving rise to a doubling of network traffic every 1,5 years. However, this is out of step with the input/output (I/O) performance or I/O throughput of servers, which doubles every 2 years. Therefore, there is an increasing gap between the performance evolution of network equipment such as s
35、ervers, and the growth in network traffic (Figure 1) 2. _ 1Figures in square brackets refer to the Bibliography. 6 TR 62658 IEC:2013(E) Figure 1 Data transmission speed and capability trends for network traffic and server systems 2 In general, system power consumption will increase as the volume of
36、internet traffic expands. By 2020, power consumption in network routers in Japan will reach the gross power generation of Japan in 2005. An energy saving by 3 to 4 orders of magnitude in network router technology is required in 2030 to meet the stipulated targets in the Kyoto protocol 3 (Figure 2).
37、In addition, the bandwidth and density requirements for interconnects within high-performance computing systems are becoming unmanageable, due to increasing chip speeds, wider buses and larger numbers of processors per system 4. The increase in system bandwidth and density required to satisfy this d
38、emand would impose unmanageable cost and performance burdens on future data networking and storage technologies. An alternative to the current electrical printed circuit board (PCB) interconnect technology is required across multiple high-speed application spaces to mitigate this common trend. Optic
39、al interconnects are expected to bridge the performance gap between network hardware and traffic, and give rise to a reduction in hardware power consumption while increasing bandwidth density by over two orders of magnitude. IEC 1588/13 TR 62658 IEC:2013(E) 7 Figure 2 Internet traffic and router pow
40、er consumption in Japan 5 2.2 Advantages of optical interconnects Optical interconnects will be fundamental in further scaling the performance of networking, server, router, data storage and high performance computing technologies. The design and development of future higher capacity network hardwar
41、e will be hindered by high-frequency electronic constraints such as crosstalk, dielectric loss, skin effect, electro- magnetic interference (EMI) and high sensitivity to impedance matching. The maximum permissible density of electronic transmission lines is determined by the crosstalk incurred betwe
42、en electronic channels. The higher the signal frequency, the greater the separation between electronic channels required to keep crosstalk within acceptable levels. For example, the line pitch between adjacent electronic channels required to convey a signal data rate of 10 Gbps is 3 times larger tha
43、n that required to convey a signal data rate of 3 Gbps. This makes it more difficult to design and manufacture a high-capacity printed circuit board, as the electronic transmission line density must decrease as the signal speeds increase. The adoption of optical interconnects will mitigate these des
44、ign constraints. Optical waveguides neither produce nor are affected by electro-magnetic interference, and are therefore not constrained by electromagnetic compatibility regulations that impose a severe cost burden on the design of high-speed copper printed circuit boards (PCBs) and supporting inter
45、connect technologies, such as connectors. The layout advantages offered by optical waveguides will give rise to a reduction in the functional area and layer count of the PCB. The level of reduction will strongly depend on the application, with the more I/O intensive applications subject to the great
46、est potential reduction in PCB volume. Another advantage of the adoption of embedded optical interconnects in high-capacity networking, server, router, data storage and high performance computing technologies is a reduction in power consumption. As the network traffic increases, the power consumptio
47、n of network hardware is expected to increase 5 fold by 2025 and 12 fold by 2050 6. For data transmission at speeds greater than 10 Gbps, current electrical interconnects will need to be enhanced by active signal conditioning devices such as pre-emphasis and equaliser circuitry to ensure that the si
48、gnal distortion or degradation due to the mitigating factors described above remains within IEC 1589/13 8 TR 62658 IEC:2013(E) acceptable levels. In addition, the power consumption of electronic signal drivers will also increase. As signal frequencies increase, an electronic signal driver will need
49、to ramp up the signal power in order to overcome the fundamental loss mechanisms on a copper transmission line. These loss mechanisms include dielectric loss, skin effect, and the surface roughness of the copper trace, which accentuates skin effect by increasing the effective surface area. Dielectric loss effects can be mitigated to some extent by using specially high frequency printed circuit board laminate materials, however at mounting cost to t
