1、BRITISH STANDARD BS 123000:2001 System of quality assessment Generic specification Printed boards ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123000:2001 This British Standard, having been prepared under the direction of the Electrotechnical Standards Policy a
2、nd Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 17 December 2001 The following BSI references relate to work on this British Standard: Committee reference EPL/501 Draft for comment 01/204175 DC ISBN 0 580 38517 5 Committees
3、responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Contract Electronics Manufacturers Federation of the Electronics Industry GAMB
4、ICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentsBS 123000:2001 BSI 17 December 2001 i Contents Page Committees responsible Insid
5、e front cover Foreword iii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 1 4 General requirements 3 5 Capability approval and maintenance of capability approval 4 6 Quality conformity inspection 8 7 Preparation of detail specifications 10 8 Information to be agreed wit
6、h the customer 13 Annex A (informative) Example of a customer detail specification 14 Annex B (informative) Guide to the form and content of a manufacturers capability manual 15 Annex C (informative) Example of a description of capability 23 Annex D (informative) Example of a test programme matrix 2
7、4 Annex E (informative) Example of a test programme calendar 25 Annex F (informative) Example of a process description 26 Annex G (informative) Example of limits of approval 27 Annex H (informative) Example of a manufacturer-to-customer interface 28 Annex I (informative) Example of a capability qual
8、ifying component detail specification 29 Bibliography 35 Table 1 Type 1 defects 6 Table 2 Type 2 defects 6 Table 3 Group A inspection 8 Table 4 Group B inspection 9 Table 5 Group C inspection 9 Table A.1 Example of a customer detail specification 14 Table B.1 Content of a capability manual 16 Table
9、C.1 Example of a description of capability 23 Table D.1 Example of a test programme matrix 24 Table E.1 Example of a test programme calendar 25 Table F.1 Example of a process description 26 Table G.1 Example of limits of approval 27 Table H.1 Example of a manufacturer-to-customer interface 28 Table
10、I.1 Example of a capability qualifying component detail specification (CQC 1) 29 Table I.2 Example of a capability qualifying component detail specification (CQC 2) 30 Table I.3 Example of a capability qualifying component detail specification (CQC 3) 30 Table I.4 Example of a capability qualifying
11、component detail specification (CQC 4) 31 Table I.5 Example of a capability qualifying component detail specification (CQC 5) 31 Table I.6 Example of a capability qualifying component detail specification (CQC 6) 31BS 123000:2001 ii BSI 17 December 2001 Page Table I.7 Example of a capability qualify
12、ing component detail specification (CQC 7) 32 Table I.8 Example of a capability qualifying component detail specification (CQC 8) 32 Table I.9 Example of a capability qualifying component detail specification (CQC 9) 32 Table I.10 Example of a capability qualifying component detail specification (CQ
13、C 10) 33 Table I.11 Example of a capability qualifying component detail specification (CQC 11) 33 Table I.12 Example of a capability qualifying component detail specification (CQC 12) 34 Table I.13 Example of a capability qualifying component detail specification (CQC 13) 34BS 123000:2001 BSI 17 Dec
14、ember 2001 iii Foreword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series originally dated 1991. These were circulated and voted on in CENEL
15、EC, but the CENELEC Technical Board decided not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publish national standards on the
16、basis of the prEN 123000 series (Technical Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they are considered to be an imp
17、rovement upon the EN series, for the following reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in response to industry
18、 requests. c) References to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take account of new European Eco-
19、Directives. The BS 123000 series of standards is based upon the following hierarchy of specifications for the capability of manufacturers to produce printed boards: 1) generic specification (BS 123000 is a generic specification); 2) sectional specification; 3) capability detail specification; 4) cus
20、tomer detail specification. Each sectional specification covers a printed board technology type, e.g. rigid multilayer etc. For each sectional specification, further capability detail specifications and customer detail specifications are produced as needed. The BS 123000 series of standards differen
21、tiates between “basic capability” and “additional capability”. Attention is particularly drawn to 5.1, 5.3.2 and 5.3.3. Printed boards differ from most other electronic components in a number of important factors, e.g.: there are few standard boards with standard patterns and dimensions, but an infi
22、nite variety of shapes and circuit configurations; they are “custom built”, i.e. all details must be agreed between the customer and the manufacturer.BS 123000:2001 iv BSI 17 December 2001 Therefore, the Qualification Approval procedures detailed in BS QC 001002-3:1997, clause 3 (BS CECC 00114-2) ar
23、e unsuitable, and the Capability Approval procedures detailed in BS QC 001002-3:1997, clause 4 (BS CECC 00114-3) apply. The relationship between IECQ and CECC regulatory publications is shown below: Capability approval of printed board manufacturers is based upon the use of composite test patterns u
24、sed as capability qualifying components with an appropriate selection of test methods and requirements for each type of printed board. Capability approval requirements for each type of printed board are published as a separate British Standard, as follows: Annex A, Annex B, Annex C, Annex D, Annex E
25、, Annex F, Annex G, Annex H and Annex I are informative. It has been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and experienced people, for whose use it has been produced. A British Standard does not purport t
26、o include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Organization approval BS QC 001002-3:1997, clause 2 BS EN 100114-1 Qualificati
27、on approval BS QC 001002-3:1997, clause 3 BS CECC 00114-2 Capability approval BS QC 001002-3:1997, clause 4 BS CECC 00114-3 Process approval BS QC 001002-3:1997, clause 5 BS CECC 00114-5 Technology approval BS QC 001002-3:1997, clause 6 BS EN 100114-6 Mark of attestation No publication BS CECC 00108
28、 Ad hoc guidance to NSIs No publication ECQAC Permanent Documents Rigid single-sided and double-sided with plain holes BS 123100 Rigid double-sided with plated-through holes BS 123200 Rigid multilayer BS 123300 Flexible single-sided and double-sided without through-connections BS 123400 Flexible sin
29、gle-sided and double-sided with through-connections BS 123500 Flex-rigid multilayer with through-connections BS 123600 Flex-rigid double-sided with through-connections BS 123700 Flexible multilayer with through connections BS 123800 Summary of pages This document comprises a front cover, an inside f
30、ront cover, pages i to iv, pages 1 to 35 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued.BS 123000:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies a system by which manufacturers of printed boards can be granted ca
31、pability approval within the IECQ system for electronic components of assessed quality. It also specifies procedures for the preparation of capability detail specifications and customer detail specifications for printed boards. This British Standard is applicable for all printed boards, irrespective
32、 of their method of manufacture. It is applicable to printed board manufacturers when using the IECQ system for electronic components of assessed quality. NOTE Technology approval is the preferred procedure for manufacturers who wish to implement in-process testing as an element of their IECQ approv
33、al. CECC 210003 is a technology approval schedule for printed boards. In addition to the definitive requirements, this standard also requires the items specified in clause 8 to be documented. For compliance with this standard, both the definitive requirements and the documented items have to be sati
34、sfied. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, t
35、he latest edition of the publication referred to applies. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and electronics Group 11: Printed circuits. BS 6001-1 (ISO 2859-1
36、), Sampling procedures for inspection by attributes Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS CECC 00114-3:1993, Rule of procedure 14 Quality assessment procedures
37、 Part 3: Capability approval of an electronic component manufacturing activity. BS QC 001002-3:1997, Rules of procedure of the IEC quality assessment system for electronic components (IECQ) Part 3: Approval procedures, including a new clause on technology approval. ECQAC Permanent Document 1120, Req
38、uirements for the drafting of qualification approval and capability approval test reports 1) . 3 Terms and definitions For the purposes of this British Standard the terms and definitions given in BS 4727-1:Group 11 and the following apply. 3.1 capability ability of a manufacturer to produce printed
39、boards of a quality recognized by the National Supervising Inspectorate (NSI) 3.2 basic capability capability defined in a British, CECC or IEC capability detail specification NOTE The term “basic” is intended to indicate a minimum level of assessment, testing or requirement. 1) Available from the N
40、SI, BSI Product Services, Maylands Avenue, Hemel Hempstead, HP2 4SQ.BS 123000:2001 2 BSI 17 December 2001 3.3 additional capability capability other than those defined as basic capabilities NOTE Examples of additional capability include: maximum size of printed boards that can be processed; minimum
41、diameter of plated-through holes relative to board thickness (aspect ratio); minimum conductor width and/or spacing; maximum number of layers; surface finish. 3.4 designated management representative person designated by the manufacturer to ensure that work is carried out in accordance with this Bri
42、tish Standard 3.5 structurally similar boards printed boards having all of the following common features: the same type of metal-clad base material, e.g. 249-2-4-IEC-GC-Cu; the same type of printed board, e.g. rigid single-sided or double-sided with plain holes; the same type of surface finish, e.g.
43、 fused tin-lead 3.6 capability qualifying component (CQC) component used for the demonstration of capability and the subsequent maintenance of capability 3.7 composite test pattern (CTP) arrangement of individual specimens to form the board pattern used for the demonstration of capability NOTE A sin
44、gle composite test pattern represents the smallest size panel for which approval to a sectional specification can be gained. 3.8 specimen individual circuit pattern used to assess limits of approval 3.9 aspect ratio ratio of the length or depth of a hole to its pre-plated diameter NOTE In practice t
45、his should be calculated as the nominal board thickness of base material divided by the smallest drill diameter, e.g. Aspect ratio is used as a measure of the ability of a manufacturer to overcome the difficulties present when a small hole is to be plated through. When aspect ratio is to be evaluate
46、d for capability approval the manufacturer should choose the smallest hole diameter which can be plated through the board to achieve the requirements of the standard. A smaller drill diameter than that used to verify aspect ratio may be claimed, provided that the maximum aspect ratio is not exceeded
47、. 3.5 mm 0.4 mm - 8.75:1 =BS 123000:2001 BSI 17 December 2001 3 4 General requirements 4.1 Claims of capability Manufacturers shall be able to demonstrate the claimed capability of their facility and processes. Manufacturers shall ensure that any additional capability is claimed, proven and recogniz
48、ed by NSI as an additional capability. 4.2 Eligibility for capability approval Manufacturers of printed boards shall be deemed to be eligible for approval under this series of specifications if they are capable of conducting at least three of the following processes in-house: hole formation; imaging
49、; interlayer connection; etching; bonding. 4.3 Sub-contracting All production processes shall be carried out under the surveillance of the designated management representative. If a sub-contractor is used to carry out processing, the manufacturer shall be able to demonstrate that disciplines are maintained by the sub-contractor that are equivalent to those applied at the approved manufacturers facility. 4.4 Delayed delivery When printed boards are held by the
