1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R112-95. 95-04-11 K. A. Cottongim B Changes in accordance with NOR 5962-R174-95. 95-07-28 K. A. Cottongim C Changes to table I. 99-03-16 K. A. Cottongim D Correct paragraphs 4.2.a.2. and 4.3.3.b.2. Figure 1, up
2、date to standard SMD format of symbols and dimensioning table. -gz 07-03-01 Joseph Rodenbeck E Table II, add note to Group C end-point test parameters. Paragraphs 4.2.a.2 and 4.3.3.b.2, reinstate original paragraphs. Update boilerplate paragraphs. -gz 11-11-10 Charles F. Saffle REV SHEET REV SHEET R
3、EV STATUS REV E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Steve L. Duncan DLA ALND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael C. Jones COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS
4、 APPROVED BY Kendall A. Cottongim MICROCIRCUIT, HYBRID, LINEAR, +5 and 15 VOLT, TRIPLE CHANNEL, DC/DC CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-12-02 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-92116 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E069-12Provide
5、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92116 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance
6、classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as s
7、hown in the following example: 5962 - 92116 01 H Z X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA mark
8、ed devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 AHV2815TF/CH DC/DC
9、converter, 15 W, +5 V and 15 V outputs 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E)
10、or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applicati
11、ons where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarante
12、es (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; there
13、fore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range.
14、1.2.4 Case outline. The case outline are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Z See figure 1 10 Flange mount 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. Provided by IHSNot for ResaleNo reproduction
15、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92116 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Input voltage range -0.5 V dc to +50 V dc (continuous), 80 V (100 ms) P
16、ower dissipation (PD) . 10 W Lead temperature (soldering, 10 seconds) +300C Storage temperature range -65C to +150C 1.4 Recommended operating conditions. Input voltage range +16 V dc to +40 V dc Output currents: +5 V output 2000 mA 15 V output 167 mA Output power 2/ 3/ 15 W Case operating temperatur
17、e range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in th
18、e solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF D
19、EFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadel
20、phia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been ob
21、tained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quali
22、ty Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification
23、in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derate output
24、 power linearly above case temperature +125C to 0 at +135C. 3/ At least 25 percent of the total power should be from the main (+5 volt) output. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92116 DLA LAND A
25、ND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline. The case outline shall be in accordance wit
26、h 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance cha
27、racteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of
28、 devices. Marking of devices shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer
29、 of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, a
30、re guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to
31、 supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF
32、-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in th
33、e QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maint
34、ained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
35、 specified in method 1015 of MIL-STD-883. (2) TCas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion o
36、f the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92116 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance charact
37、eristics. Test Symbol Conditions -55C TC+125C VIN= 28 V dc 5%, CL= 0 unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output voltage 1/ VOUTIOUT= 0 (main) 1 01 4.95 5.05 V 2,3 4.90 5.10 IOUT= 0 (dual) 1 14.85 15.15 2,3 14.70 15.30 Output current 1/ 2/ 3/ IOUTVIN= 16, 28,
38、and 40 V dc (main) 1,2,3 01 100 2000 mA VIN= 16, 28, and 40 V dc (dual) 1,2,3 0 167 Output ripple voltage 1/ 4/ VRIPVIN= 16, 28, and 40 V dc, B.W. = 20 Hz to 2 MHz (main) 1,2,3 01 80 mV p-p VIN= 16, 28, and 40 V dc, B.W. = 20 Hz to 2 MHz (dual) 1,2,3 40 Line regulation 1/ 3/ VRLINEVIN= 16, 28, and 4
39、0 V dc, IOUT= 100, 1000, and 2000mA (main) 1,2,3 01 25 mV VIN= 16, 28, and 40 V dc, IOUT= 0, 104, and 208 mA (dual) 1 01 35 2,3 75 Load regulation 1/ 3/ VRLOADVIN= 16, 28, and 40 V dc, IOUT= 100, 1000, and 2000mA (main) 1,2,3 01 50 mV VIN= 16, 28, and 40 V dc, IOUT= 0, 84, and 167 mA (dual) 75 Input
40、 current IINIOUT= 0, inhibit (pin 8) tied to input return (pin 10) 1,2,3 01 15 mA IOUT= 0, inhibit (pin 8) = open 50 Input ripple current 4/ IRIPIOUT= 2000 mA (main), IOUT= 2167 mA (dual), B.W. = 20 Hz to 2 MHz 1,2,3 01 50 mA p-p Efficiency EFFIOUT= 2000 mA (main), IOUT= 167 mA (dual) 1 01 72 % 2,3
41、68 Isolation ISO Input to output or any pin to case (except pin 7) at 500 V dc, TC= +25C 1 01 100 M See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92116 DLA LAND AND MARITIME C
42、OLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC+125C VIN= 28 V dc 5%, CL= 0 unless otherwise specifiedGroup A subgroups Device type Limits Unit Min Max Power dissipation load fault 3/
43、PDOverload 5/ 1,2,3 01 10 W Short circuit 10Switching frequency 1/ FSIOUT= 2000 mA (main), IOUT= 167 mA (dual) 4,5,6 01 450 550 kHz Inhibit open circuit voltage VOI1,2,3 01 9 13 V Output response to step transient load changes 6/ VOTLOAD50 percent load to/from 100 percent load 4 01 -300 +300 mV pk 5
44、,6 -400 +400Minimum load to/from 50 percent load 4 -400 +4005,6 -600 +600Recovery time step transient load changes 6/ 7/ TTLOAD50 percent load to/from 100 percent load 4 01 100 s 5,6 200Minimum load to 50 percent load 4,5,6 2000 50 percent load to minimum load 4,5,6 5000 Output response transient to
45、 step line changes 8/ 9/ VOTLINE Input step 16 from/to 40 V dc, IOUT= 2000 mA (main), IOUT= 167 mA (dual) 4,5,6 01 1500 mV pk Recovery time transient step line changes 7/ 8/ 9/ TTLINEInput step 16 from/to 40 V dc, IOUT= 2000 mA (main), IOUT= 167 mA (dual) 4,5,6 01 5 ms Load fault recovery 9/ TrLF4,5
46、,6 01 15 ms Turn on overshoot 1/ VTonOSIOUT= 100 and 2000 mA (main), IOUT= 0 and 167 mA (dual)4,5,6 01 750 mV pk Turn on delay 1/ 10/ TonDIOUT= 100 and 2000 mA (main), IOUT= 0 and 167 mA (dual)4,5,6 01 15 ms 1/ Tested at each output. 2/ Parameter guaranteed by line and load regulation tests. 3/ At l
47、east 25 percent of the total output power should be taken from the (+5 volt ) main output. 4/ Bandwidth guaranteed by design. Tested for 20 kHz to 2 MHz. 5/ An overload is that condition with a load in excess of the rated load but less than that necessary to trigger the short circuit protection and
48、is the condition of maximum power dissipation. 6/ Load step transition time between 2 and 10 microseconds. 7/ Recovery time is measured from the initiation of the transient to where VOUThas returned to within 1 percent of VOUT at 50 percent load. 8/ Input step transition time between 2 and 10 microseconds. 9/ Parameter shall be
