1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. Editorial changes throughout. - les. 00-11-06 Raymond Monnin B Update drawing to current requirements. Editorial changes throughout. - gap 08-05-02 Robert M. Heber REV SHET REV SHET REV STATUS REV
2、B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas M. Hess COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVE
3、D BY Thomas M. Hess MICROCIRCUIT, DIGITAL, BIPOLAR, TTL, DUAL J-K FLIP-FLOPS WITH PRESET AND AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-01-19 CLEAR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-95575 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E047-08
4、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95575 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two pr
5、oduct assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (
6、RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95575 01 Q E X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2)Deviceclass designatorCaseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.
7、1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A
8、dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 5476 Dual J-K flip-flops with preset and clear 1.2.3 Device class designator. The device class designator is a single letter identify
9、ing the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-385
10、35 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual in line package F GDFP2-F16 or CDFP3-F16 16 flat package 1.2.5 Lead finish. The lead finish is as specified i
11、n MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95575 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVIS
12、ION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range -0.5 V dc minimum to +7.0 V dc maximum Input voltage . 5.5 V dc Storage temperature . -65C to +150C Maximum power dissipation (PD) 110 mW 2/ Lead temperature (soldering, 10 seconds) . +300C Thermal resist
13、ance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V Maximum low level input voltage (VIL) . 0.8 V dc 2/ Ambient operating t
14、emperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those
15、cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outl
16、ines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk
17、, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulati
18、ons unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation is defined as VCCx ICC, and must withstan
19、d the added PDdue to short circuit test, e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95575 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 9
20、7 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, f
21、it, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensio
22、ns shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on fig
23、ure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance charac
24、teristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defin
25、ed in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“
26、on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certifi
27、cation mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a
28、 QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of
29、 compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and here
30、in. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For d
31、evice class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the o
32、ption to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group
33、 number 003 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95575 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE
34、 I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOHVCC= 4.5 V, VIL= 0.8 V VIH= 2.0 V, IOH= -0.4 mA 1, 2, 3 2.4 V Low level output voltage VOLVCC= 4.5 V, VIH= 2.0 V VIL= 0.8 V, I
35、OL= 16 mA 1, 2, 3 0.4 V Input clamp voltage VIKVCC= 4.5 V, IIN= -12 mA 1, 2, 3 -1.5 V High level input current IIH1 VCC= 5.5 V VIN= 5.5 V 1, 2, 3 1 mA J or K -1.6 Low level input current IIL VCC= 5.5 V VIN= 0.4 V 1/ All other 1, 2, 3 -3.2 mA J or K 40 High level input current IIH2 VCC= 5.5 V VIN= 2.
36、4 V All other 1, 2, 3 80 A Short circuit input current IOSVCC= 5.5 V 2/ 1, 2, 3 -20 -57 mA Supply current ICC VCC= 5.5 V 3/ 1, 2, 3 20 mA Functional test VCC= 4.5 V, 5.5 V See 4.4.1b 7, 8 Maximum clock frequency fMAX VCC= 5.0 V, RL= 400, 9 15 MHz tPLH 25 Propagation delay time, PRE or CLR to Q or Q
37、tPHLCL= 15 pF 9 40 ns tPLH 25 Propagation delay time, CLK to Q or Q tPHL9 40 ns Pulse duration tWCLK high 9 20 ns CLK low 9 47 PRE or CLR low 9 25 Input setup time data before CLK tSU9 0 ns Input hold time data after CLK th9 0 ns 1/ Clear is tested with preset high and preset is tested with clear hi
38、gh. 2/ Not more than 1 output should be shorted at a time. 3/ With all outputs open, ICCis measured with the Q and Q outputs high in turn. At the time of measurement, the clock input is grounded. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA
39、RD MICROCIRCUIT DRAWING SIZE A 5962-95575 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F Terminal number Terminal symbol 1 1 CLK 2 1 PRE 3 1 CLR 4 1 J 5 VCC6 2 CLK 7 2 PRE 8 2 CLR 9 2 J 10 2 Q 11 2 Q 12 2 K
40、 13 GND 14 1 Q 15 1 Q 16 1 K FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95575 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2
41、234 APR 97 Inputs Outputs PRE CLR CLK J K Q Q L H X X X H L H L X X X L H L L X X X H 1/ H 1/ H H L L Q0Q 0 H H H L H L H H L H L H H H H H Toggle Notes: H = High voltage level. L = Low voltage level. X = Irrelevant. = One high level pulse. Q0= Level of Q before the indicated steady-state input cond
42、itions were established. Q0= Complement of Q0or level Q0before the indicated steady-state input conditions were established. Toggle = Each output changes to the complement of its previous level on each active transition indicated by or . 1/ This configuration is nonstable, that is, it will not persi
43、st when either preset or clear returns to its inactive (high) level. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95575 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVIS
44、ION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95575 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC
45、FORM 2234 APR 97 NOTES: 1. CL= 15pF and RL= 400 . CLincludes probe and jig capacitance. 2. All diodes are 1N3064, 1N916 or equivalent. FIGURE 4. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU
46、IT DRAWING SIZE A 5962-95575 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified i
47、n the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q
48、and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufa
