1、Analysis of PC Chip Heat Sink Design,Royce Tatton ME 340 Dr. Solovjov Fall 2006,The Problem,Problem 3.137 in Incropera and DeWitt Comparison of two fin arrays to be used as PC chip heat sink Which provides more heat transfer (better cooling)?,The Chip,Material Ceramic Porcelain Dimensions 53 X 57 X
2、10 mm Temperature 75 C Maximum,Design A,Dimensions 3 X 3 X 30 mm Number 6 X 9 array (54 total) Material 6061 Aluminum Convection Coefficient 125 W/m2K,Design B,Dimensions 1 X 1 X 7 mm Number 14 X 17 array (238 total) Material 6061 Aluminum Convection Coefficient 375 W/m2K,Methods,Use COSMOSWorks 200
3、6 to determine maximum flux and temperature distribution in Design A and Design B Compare to analytical results,Setup of Problem,Simplify by reducing to of the total geometry along symmetry planes Apply temperature constraints to chip surfaces Apply convection loads to top chip surface and fins,Resu
4、lts Design A,Maximum chip temperature of 75C (348.15 K) Resultant heat flux of 7.807E+5 W/m2,Temperature Plot,Heat Flux Plot,Results Design B,Maximum chip temperature of 75C (348.15 K) Resultant heat flux of 1.002E+6 W/m2 Design B provides greater cooling of chip,Temperature Plot,Heat Flux Plot,Conc
5、lusions,Design B provides better cooling to the chip Results agree with the results of the problem in the textbook Conduction coefficient very significant factor “Bigger” is not always better,Recommendation,Always perform heat transfer analysis before making decision on intuition Further analysis with radiation and other materials to find a better fin design,
