1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. -sld 02-12-16 Raymond Monnin B Figure 1, case outlines Y and Z, change the maximum D/E dimension from 1.105“ (28.07 mm) to 1.110“ (28.19 mm) and change the R maximum dimension from .600“ (1.52 mm)
2、to .065“ (1.65 mm). 05-04-18 Raymond Monnin C Add device type 02 non-RHA class H and RHA levels P, L, R, classes H and K. -gz 07-08-06 Robert M. Heber D Added footnote 1 to table II, under group C end-point electricals. -sld 09-07-16 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV D D D D D D D
3、 D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael C. Jones THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES O
4、F THE DEPARTMENT OF DEFENSE APPROVED BY Raymond Monnin MICROCIRCUIT, HYBRID, LINEAR, 5 VOLT, DUAL CHANNEL, DC/DC CONVERTER DRAWING APPROVAL DATE 00-10-02 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-00522 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E373-09Provided by IHSNot for ResaleNo reprod
5、uction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-00522 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in
6、paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following
7、example: 5962 - 00522 01 H X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet
8、the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 MSA2805D/883, MGA2805D DC-DC conver
9、ter, 5 W, 5 V outputs 02 SMSA2805D DC-DC converter, 5 W, 5 V outputs 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qual
10、ification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is
11、 intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow,
12、 and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the devic
13、e acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have
14、a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-00522 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s)
15、. The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 8 Dual-in-line Y See figure 1 20 Flat pack Z See figure 1 20 Flat pack with formed leads 1.2.5 Lead finish. The lead finish shall be as specified in MI
16、L-PRF-38534. 1.3 Absolute maximum ratings. 1/ Input voltage range -0.5 V dc to +50 V dc Power dissipation (PD) . 2.2 W Output power 2/ . 5.23 W Lead soldering temperature (10 seconds) . +300C Storage temperature range -65C to +150C 1.4 Recommended operating conditions. Input voltage range +16 V dc t
17、o +40 V dc Case operating temperature range (TC) -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 9 rad(Si)/s): Device type 02 (RHA levels P, L, and R) . 100 krad (Si) 3/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following spec
18、ification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification
19、for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copi
20、es of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references
21、 cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute maximum rating may cause permanent damage to the device, except for input voltage tran
22、sients up to 80 V for no more than 120 milliseconds. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derate output power linearly above case temperature (TC) of +125C to 0 W at +130C. 3/ These parts may be dose rate sensitive in a space environment and may
23、 demonstrate enhanced low dose rate effects. Radiation end-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition C, tested at 9 rad(Si)/s. Provided by IHSNot for ResaleNo reproduction or networking permitted without license f
24、rom IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-00522 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in acc
25、ordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspe
26、ctions herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical
27、 dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
28、3.2.3 Radiation exposure circuit. If radiation exposure circuits are used, they shall be documented in the test plan. The original exposure circuit(s) and any subsequent revisions to these circuits shall be maintained by the manufacturer under revision level control. 3.3 Electrical performance chara
29、cteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II.
30、The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In ad
31、dition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should in
32、clude a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate
33、 of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A ce
34、rtificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quali
35、ty Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition
36、 A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable,
37、 in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in ar
38、e optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-00522 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97
39、TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TC +125C VIN= 28 V dc 0.5 V, CL = 0unless otherwise specified Group A subgroups Device types Limits Unit Min Max Output voltage +VOUTIOUT= 0.5 A 1 01,02 +4.95 +5.05 V dc 2,3 +4.80 +5.20 P,L,R 1,2,3 02 +4.75 +5.30 -VOU
40、T1 01,02 -4.90 -5.10 2,3 -4.75 -5.25 P,L,R 1,2,3 02 -4.65 -5.35 Output current 3/ IOUTVIN= 16 V dc to 40 V dc 1,2,3 01,02 0.0 0.8 A P,L,R 1,2,3 02 0.0 0.8 VOUToutput ripple voltage (VOUT) VRIPIOUT= 0.5 A, B.W. = 10 kHz to 2 MHz 1 01 150 mV p-p 2,3 300 1,2,3 02 300 P,L,R 1,2,3 02 348 VOUTline regulat
41、ion (+VOUT) VRLINEIOUT= 0.5 A, VIN= 16 V dc to 40 V dc 1,2,3 01 25 mV 1 02 50 2,3 100 P,L,R 1,2,3 02 200 (-VOUT) 1,2,3 01 75 1 02 50 2,3 200 P,L,R 1,2,3 02 400 VOUTload regulation (+VOUT) VRLOADIOUT= 0 to 0.5 A, both outputs changed 1,2,3 01,02 50 mV simultaneously P,L,R 1,2,3 02 100 (-VOUT) 1,2,3 0
42、1,02 200 P,L,R 1,2,3 02 400 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-00522 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 223
43、4 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TC +125C VIN= 28 V dc 0.5 V, CL = 0unless otherwise specified Group A subgroups Device types Limits Unit Min Max Input current IINIOUT= 0 A, Inhibit pin = 0 V dc 1,2,3 01 5 mA 02 8 P,L,R 1,2,3 02
44、35 IOUT= 0 A, Inhibit pin = open 1,2,3 01 35 02 50 P,L,R 1,2,3 02 100 Input ripple current IRIPIOUT= 0.5 A, LIN= 2 H, B. W. = 10 kHz to 10 MHz 1 01 80 mA p-p 2,3 160 1,2,3 02 200 P,L,R 1,2,3 02 350 Efficiency Eff IOUT= 0.5 A 1 01 68 % 02 65 2,3 01 65 02 63 P,L,R 1,2,3 02 60 Isolation ISO Input to ou
45、tput or any pin to case, (except case ground pin(s) at 500 V dc, (see figure 1 01,02 100 M 2) TC= +25C P,L,R 1 02 100 Short circuit internal power dissipation PDShort circuit PD= PIN- total POUT1 01 1.8 W 02 2.0 2,3 01 2.0 02 2.1 P,L,R 1,2,3 02 2.2 See footnotes at end of table. Provided by IHSNot f
46、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-00522 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symb
47、ol Conditions 1/ 2/ -55C TC +125C VIN= 28 V dc 0.5 V, CL = 0unless otherwise specified Group A subgroups Device types Limits Unit Min Max Switching frequency FSIOUT= 0.5 A 4 01 450 600 kHz 02 450 580 5,6 01 400 620 02 410 580 P,L,R 4,5,6 02 400 597 VOUTresponse to step transient load changes 4/ (VOU
48、T) VOTLOAD50% load to/from 100% load; balanced loads on each output 4 01 -150 +150 mV pk 02 -400 +400 5,6 01 -500 +500 02 -1400 +1400 P,L,R 4,5,6 02 -1400 +1400 VOUTrecovery time from step transient load changes 4/ 5/ 6/ (VOUT) TTLOAD50% load to/from 100% load; balanced loads on each output 4 01 100 s 02 500 5,6 01 1000 02 4500 P,L,R 4,5,6 02 4500 VOUTresponse to step transient changes 6/ 7/ VOTLINEInput step from 16 V dc to 40 4,5,6 01,02 -750 +
