1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 09-12-10 C. SAFFLE REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER
2、 COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH R. PITHADIA APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, 150 MHz PHASE LOCKED LOOP, MONOLITHI
3、C SILICON DRAWING APPROVAL DATE 94-04-18 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-94582 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E063-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94582 DEFE
4、NSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines
5、and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 94582 01 M R A Federal stock class designator RHA de
6、signator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA design
7、ator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Cir
8、cuit function 01 568A 150 MHz phase locked loop 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant,
9、non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-
10、T20 or CDIP2-T20 20 Dual in line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA
11、WING SIZE A 5962-94582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) 6 V Power dissipation (PD) 400 mW Junction temperature (TJ) . +150C Storage temperature . -65C to +150C Thermal resista
12、nce, junction to case (JC) See MIL-STD-1835 Thermal resistance, junction to ambient (JA) . 85C/W 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V to 5.5 V Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, a
13、nd handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Ci
14、rcuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-78
15、0 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between t
16、he text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage
17、to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321
18、8-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modi
19、fication in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensi
20、ons. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. T
21、he terminal connections shall be as specified on figure 1. 3.2.4 Block diagram. The block diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post
22、irradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I.
23、3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device.
24、For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for
25、 device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 list
26、ed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance sub
27、mitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certifi
28、cate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M,
29、notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review
30、 the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 110 (se
31、e MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical
32、performance characteristics. Test Symbol Conditions 1/ -55C TA+125C Group A subgroups Device type Limits 2/ Unit unless otherwise specified Min Max Supply voltage VCC1,2,3 01 4.5 5.5 V Supply current ICC1,2,3 01 70 mA Demodulated VOUTVODDeviation = 20 % of fOmeasured at VOUTpin 1,2,3 01 0.40 VPPMaxi
33、mum oscillator operating frequency fMO3/ 4,5,6 01 150 MHz Input signal level ISL 4,5,6 01 50 -20 2000 +10 mVPPdBm Nonlinearity NL Deviation = 20 %, 4/ input = -20 dBm 4,5,6 01 4.0 % Lock range LR Input = -20 dBm 5/ 4,5,6 01 -25 +25 % of fOCapture range CR Input = -20 dBm 5/ 4,5,6 01 -20 +20 % of fOI
34、nput resistance RIN4,5,6 01 1 k Distribution fOCentered at 70 MHz, 6/ R2= 1.2 k, C2= 17 pF, R4= 3.9 k, (C2+ CSTRAY= 20 pF) 4,5,6 01 -15 +15 % 1/ Unless otherwise specified, VCC= 5 V, fO= 70 MHz, fIN= -20 dBm, and R4= 3.9 k. See figure 3. 2/ The algebraic convention, whereby the most negative value i
35、s a minimum and the most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device terminal. 3/ If not tested, shall be guaranteed to the limits specified in table I herein. 4/ Linearity is tested with incremental changes in input fr
36、equency and measurement of the dc output voltage at the VOUT. Non-linearity is then calculated from a straight line over the deviation range specified. 5/ Limits are set symmetrical to fO. Actual characteristics may have asymmetry beyond the specified limits. 6/ Free running frequency is measured as
37、 feedthrough to the VOUTwith no input signal applied. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR
38、 97 Device type 01 Case outline R Terminal number Terminal symbol Description 1 VCC2Second power supply voltage. 2 GND 2 Second device ground. 3 GND 1 First device ground. 4 TCAP 1 First current controlled oscillator input. 5 TCAP 2 Second current controlled oscillator input. 6 GND 1 First device gr
39、ound. 7 VCC1First power supply voltage. 8 REFBYP Reference bypass. Bypass cap to future reference. 9 PNPBYP PNP bypass. Bypass cap to future PNP input to current controlled oscillator (ICO). 10 INPBYP Input bypass. Bypass cap to future input to amplifier. 11 VINInput voltage. 12 TCADJ1First temperat
40、ure compensation resistor. 13 TCADJ2Second temperature compensation resistor. 14 VOUTOutput voltage. 15 OUTFILTFilter output. 16 FREQ ADJ Frequency adjust. 17 LF 4 Fourth loop filter. 18 LF 3 Third loop filter. 19 LF 2 Second loop filter. 20 LF 1 First loop filter. FIGURE 1. Terminal connections. Pr
41、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Block diagram. Provided by IHSNot for Resa
42、leNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 C1, C3, C4,C6, C7, C8, C12, and C13= 100 nF. C2= 18 nF (see note 1). C2= 16 n
43、F (see note 2). C5= 6.8 F. C9and C11= 47 pF. C10= 560 pF. R1= 27 , R2= 2 k, R3= 43 (see note 3), R4= 3.9 k, (see note 4), and R5= 3.9 k (see note 3). RFC1and RFC2= 10 H NOTES: 1. 18 pF with the TCADJ1grounded and the TCADJ2flat. 2. C2and CSTRAY= 16 pF for temperature compensated configuration with R
44、4= 3.9 k. 3. For 50 setup. R1= 62 and R3= 75 for 75 application. 4. For test configuration R4= 0 (GND) and C2= 18 pF. FIGURE 3. Test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94582 DEFENSE SUPP
45、LY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Managem
46、ent (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance wi
47、th MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional
48、criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test paramete
