1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Corrected input voltage levels to Figures 4 and 5 in footnote 3 and art work on figure 4. Update boilerplate. LTG 00-08-11 Monica L. Poelking B Update boilerplate to MIL-PRF-38535 requirements. LTG 01-03-28 Thomas M. Hess C Update boilerplate par
2、agraphs to the current MIL-PRF-38535 requirements. - LTG 09-07-15 Thomas M. Hess REV SHET REV C SHET 15 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.
3、dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Charles F. Saffle, Jr. APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, LOW VOLTAGE CMOS, QUADRUPLE 2-INPUT POSITIVE-AND GATE, MONOLITHIC SILICON
4、DRAWING APPROVAL DATE 97-03-27 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-97534 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E362-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97534 DEFENSE SUPPLY
5、 CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead f
6、inishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 97534 01 Q C A Federal stock class designator RHA designator (
7、see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Devi
8、ce class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit funct
9、ion 01 54LVC08A Quadruple 2-input positive-AND gate 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 complia
10、nt, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GD
11、IP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo repro
12、duction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +6.5 V d
13、c DC input voltage range (VIN) -0.5 V dc to +6.5 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc 4/ 5/ DC input clamp current (IIK) (VINVCC) 50 mA Continuous output current (IO) (VOUT= 0 to VCC) 50 mA Continuous current through VCCor GND . 100 mA Maximum power dissipation at TA=
14、+55C (in still air) (PD) . 500 mW 6/ Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +150C 1.4 Recommended operating conditions. 2/ 3/ 7/ Supply voltage (VCC): Opera
15、ting range . +2.0 V dc to +3.6 V dc Data retention only . +1.5 V dc Minimum high level input voltage (VIH), VCC= 2.7 V to 3.6 V . +2.0 V Maximum low level input voltage (VIL), VCC= 2.7 V to 3.6 V +0.8 V Input voltage range (VIN) +0.0 V dc to 5.5 V dc Output voltage range (VOUT) . +0.0 V dc to VCCMax
16、imum high level output current (IOH): VCC= 2.7 V -12 mA VCC= 3.0 V -24 mA Maximum low level output current (IOL): VCC= 2.7 V +12 mA VCC= 3.0 V +24 mA Input transition rise or fall rate (t/V) 0.0 ns/V to 8.0 ns/V Case operating temperature range (TC) . -55C to +125C 1/ Stresses above the absolute max
17、imum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange
18、 and case temperature range of -55C to +125C. 4/ The input and output negative-voltage ratings may be exceeded provided that the input and output clamp-current ratings are observed. 5/ The value of VCCis provided in the recommended operating conditions in section 1.4 above. 6/ The maximum package po
19、wer dissipation is calculated using a junction temperature of 150C and a board trace length of 750 mils. 7/ Unused inputs must be held high or low to prevent them from floating. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DR
20、AWING SIZE A 5962-97534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the ext
21、ent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Metho
22、d Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.d
23、la.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these
24、documents cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 52 - Standard for Description of Low voltage TTL-compatible CMOS Logic Device (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 W
25、ilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
26、 exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan
27、shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, constru
28、ction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connection
29、s shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce test circuit and waveforms. The ground bounce test circuit and waveforms shall be as specified on f
30、igure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97534 DEFENSE SUPPLY CENTER COL
31、UMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table
32、 I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed
33、 in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator sha
34、ll still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as requir
35、ed in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of
36、 this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source
37、of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as requ
38、ired for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 her
39、ein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required docum
40、entation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for Resal
41、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test met
42、hod 1/ Symbol Test conditions 2/ -55C TC +125C +2.0 V VCC +3.6 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max High level output voltage 3006 VOHFor all inputs affecting output under test VIN= VIHor VILFor all other inputs VIN= VCCor GND IOH= -100 A 2.7 V and 3.6 V 1, 2, 3 V
43、CC-0.2 V IOH= -12 mA 2.7 V 1, 2, 3 2.2 3.0 V 2.4 IOH= -24 mA 3.0 V 1, 2, 3 2.2 Low level output voltage 3007 VOLFor all inputs affecting output under test VIN= VIHor VILFor all other inputs VIN= VCCor GND IOL= 100 A 2.7 V and 3.6 V 1, 2, 3 0.2 V IOL= 12 mA 2.7 V 1, 2, 3 0.4 IOL= 24 mA 3.0 V 1, 2, 3
44、0.55 Input current high 3010 IIHFor input under test VIN= 5.5 V For all other inputs VIN= 5.5 V or GND 3.6 V 1, 2, 3 +5.0 A Input current low 3009 IILFor input under test VIN= GND For all other inputs VIN= 5.5 V or GND 3.6 V 1, 2, 3 -5.0 A Quiescent supply current 3005 ICCFor all inputs VIN= VCCor G
45、ND IOUT= 0 A 3.6 V 1, 2, 3 10.0 A Quiescent supply current delta ICCOne input at VCC-0.6 V Other inputs at VCCor GND 2.7 V and 3.6 V 1, 2, 3 500 A Input capacitance 3012 CINTC= +25C VIN= VCCor GND, See 4.4.1c 3.3V 4 9.0 pF Power dissipation capacitance CPD4/ CL= 50 pF, f = 1 MHz See 4.4.1c, TC= +25C
46、 3.3 V 4 10 pF Low level ground bounce noise VOLP5/ VIH= 2.7 V,VIL= 0.0 V TA= +25C See 4.4.1d See figure 4 3.0 V 4 900 mV Low level ground bounce noise VOLV5/ 3.0 V 4 -700 mV High level VCCbounce noise VOHP5/ 3.0 V 4 550 mV High level VCCbounce noise VOHV5/ 3.0 V 4 -550 mV Functional test 3014 6/ VI
47、N= VIHor VILVerify output VOSee 4.4.1b 2.0 V and 3.6 V 7, 8 L H See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-97534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 RE
48、VISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.0 V VCC +3.6 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max Propagation delay time, mA or mB to mY 3003 tPHLtPLH7/ CL= 50 pF RL= 500 See figure 5 2.7 V 9, 10, 11 1.0 4.8 ns 3.0 V and 3.6 V 1.0 4.1 1/ For tests not listed in the referenced MIL-STD-883, utilize the general test procedure of 883 under the conditions listed herein. 2/ Each input/output, as applicabl
