DLA DSCC-DWG-03024 REV B-2013 SHIELDING BEAD ELECTRONIC CHIP FERRITE HIGH RELIABILITY.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Addition of pure tin prohibition requirement. Add new paragraph 3.12 and update drawing format throughout. 21 May 2013 Michael Radecki B Corrected typographical and referenced paragraphs errors. Added a NOTE to paragraph 4.6.15 and a subparagraph to 4.6.17.

2、 25 June 2013 Michael Radecki Prepared in accordance with ASME Y14.100 REV STATUS OF PAGES REV 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PAGES B B B B B B B B B B B B B B B B PMIC N/A PREPARED BY Ken R. Beymer DESIGN ACTIVITY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing July 24

3、, 2003 CHECKED BY Ken R. Beymer TITLE SHIELDING BEAD, ELECTRONIC, CHIP, FERRITE, HIGH RELIABILITY APPROVED BY Kendall A. Cottongim SIZE A CODE IDENT. NO. 037Z3 DWG NO. 03024 REV B PAGE 1 OF 16 AMSC N/A 5950-2013-E13 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME

4、COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03024 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing establishes the requirements for the scre

5、ening of ferrite chip beads. Ferrite chip beads described in this document are manufactured and screened for high reliability applications. Ferrite chip beads described herein are capable of operation over a temperature range of -55C to +125C ambient including high vacuum environments. 1.2 Part or I

6、dentifying Number (PIN). The complete PIN shall be as follows: 03024 -001 P | | | | | | Drawing Dash number Impedance tolerance number (see table I) (see table II) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standard

7、s, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (see 6.2). STANDARDS DEPARTMENT OF DEFENSE MIL-STD-202 - Test Method Standard for Electronic and Electrical Componen

8、t Parts. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The follow

9、ing documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (see 6.2). AMERICAN NATIONAL STANDARDS J-STD-004 - Requirements for Soldering Fluxes. J-STD-006 - Requirements for Elec

10、tronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. (DoD activities may obtain copies of American National Standards from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094. The private sector an

11、d other Government agencies may purchase copies from the Institute for Interconnecting and Packaging Electronic Circuits (IPC), 7380 N. Lincoln Avenue, Lincolnwood, IL 60646-1776.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER

12、, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03024 REV B PAGE 3 AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) ANSI/EIA-595 - Visual and Mechanical Inspection Multilayer Ceramic Chip Capacitors. ISO 10012 - Measurement Management Systems - Requirements for Measurement Processes and Me

13、asuring Equipment. (Applications for copies should be addressed to the American National Standards Institute (ANSI), 1819 L Street NW, Suite 600, Washington, DC 20036, https:/www.ansi.org ). AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM E595 - Standard Test Method for Total Mass Loss and Co

14、llected Volatile Condensable Materials from Outgassing in a Vacuum Environment. (Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials (ASTM), 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959.) INTERNATIONAL ELECTROTECHNICAL COMMISS

15、ION (IEC) IEC 60068-2-21 - Robustness of Terminations and Integral Mounting Devices. Applications for copies should be addressed to the Customer Service Center (CSC), International Electrotechnical Commission, 3, rue de Varembe, 1211 GENEVA 20, Switzerland.) NATIONAL CONFERENCE OF STANDARDS LABORATO

16、RIES (NCSL) NCSL Z540.3 - Requirements for Calibration of Measuring and Test Equipment. (Copies of this document are available online at www.ncsli.org or from NCSL International, 1800 30th Street, Suite 305, Boulder, CO 80701-1026.) (Non-Government standards and other publications are normally avail

17、able from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of thi

18、s document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Design and Construction. 3.1.1 Dimensions and configurations. Dimensions and configuration shall be as specified in figure 1 a

19、nd table I. 3.1.2 Terminals. The terminations shall be covered with tin/lead coating. The tin content of the coating shall not exceed 97%. Gold terminations are optional. When gold terminations are required, the procurement activity shall indicate on their purchase order that gold terminations are a

20、 requirement. Also, the minimum thickness of the gold plating shall be 50 micro-inches, as measured on crown and band area (corners excluded). With either termination finish (Sn/Pb or Gold), a Ni barrier plating is required. 3.1.3 Body. The body shall be comprised of a ferrite-based material that is

21、 substantially devoid of air. 3.2 Impedance. The impedance values for ferrite chip beads shall be as specified in table I. Impedance shall be measured in accordance with 4.6.19. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, C

22、OLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03024 REV B PAGE 4 3.3 Maximum Current Rating. The maximum current rating is the maximum amperes that the ferrite chip bead will carry at a body temperature of +25C without degradation. The applicable current rating is specified in table I.

23、3.4 Temperature Rating. The temperature rating for ferrite chip beads specified herein is -55C to +150C nonoperating. The maximum operating temperature shall not exceed a body temperature of +125C. The temperature derating curve is given in figure 2. 3.5 Maximum DC Resistance. The maximum DC resista

24、nce values for ferrite chip beads shall be as specified in table 1 and measured in accordance with 4.6.2. Configuration Dimensions A B C BW AA 0.063 0.006 (1.60 0.15) 0.031 0.006 (0.80 0.15) 0.031 0.006 (0.80 0.15) 0.014 0.006 (0.36 0.15) BB 0.079 0.008 (2.00 0.20) 0.049 0.008 (1.25 0.20) 0.035 0.00

25、8 (0.90 0.20) 0.020 0.010 (0.51 0.25) CC 0.126 0.008 (3.20 0.20) 0.063 0.008 (1.60 0.20) 0.043 0.008 (1.10 0.20) 0.020 0.010 (0.51 0.25) NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. FIGURE 1. Configuration and dimensions. Provided by IHSNot for Re

26、saleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03024 REV B PAGE 5 FIGURE 2. Current derating limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

27、IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03024 REV B PAGE 6 TABLE I. Electrical characteristics PIN 03024- Impedance (Ohms) Max.RDC(Ohms) Max. Current (Amps) Configuration 001 002 003 004 005 006 007 008 009 010 011 012 013 014 015 016 017 018 019 02

28、0 021 022 023 024 025 026 027 028 30 60 100 150 180 300 400 600 1000 30 50 60 70 100 120 150 220 330 470 600 1000 30 50 80 120 250 500 600 0.15 0.15 0.20 0.25 0.25 0.30 0.35 0.40 0.60 0.02 0.08 0.15 0.15 0.20 0.20 0.20 0.20 0.25 0.25 0.30 0.40 0.01 0.03 0.10 0.10 0.10 0.20 0.30 0.50 0.50 0.40 0.40 0

29、.40 0.20 0.20 0.20 0.20 4.00 2.00 1.50 1.50 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 4.00 3.00 1.50 1.50 1.50 1.00 1.00 AA AA AA AA AA AA AA AA AA BB BB BB BB BB BB BB BB BB BB BB BB CC CC CC CC CC CC CC TABLE II. Impedance tolerance 1/ Code Tolerance (percent) J K M P 5 10 20 25 1/ The “P” tolerance

30、 is the standard for all group A and B inspections. Tighter tolerance values (“M”,”K” and “J”) shall be screened from lots that have completed group A and B inspections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS

31、COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03024 REV B PAGE 7 3.6 Performance. 3.6.1 Thermal Shock (Group A). When ferrite chip beads are tested in accordance with 4.6.3, there shall be no evidence of electrical or mechanical damage. 3.6.2 Current Carrying Capacity. When ferrite chip beads a

32、re tested in accordance with 4.6.6, there shall be no evidence of mechanical damage and shall carry the current specified without electrical failure. 3.6.3 Termination Strength. When ferrite chip beads are tested in accordance with 4.6.7, the end terminations shall not break or loosen. The DC resist

33、ance values shall not change by more than 10 percent. 3.6.4 Thermal Vacuum. When ferrite chip beads are tested in accordance with 4.6.16, they shall not open circuit during the application of derated DC current nor shall there be evidence of arcing or mechanical damage after the test. The impedance

34、shall not change by more than 10 percent when measured after thermal vacuum exposure. 3.6.5 Bending. When ferrite chip beads are tested in accordance with 4.6.14, they shall not break or loosen. The DC resistance values shall not change by more than 10 percent. 3.6.6 Insulation Resistance. When ferr

35、ite chip beads are tested in accordance with 4.6.15, the insulation resistance shall be 1G minimum. 3.6.7 Moisture Resistance (Group C). When ferrite chip beads are tested in accordance with 4.6.8, there shall be no evidence of cracking or peeling of the ferrite body or excessive corrosion of the te

36、rminations. The impedance shall not change by more than 15 percent. 3.6.8 Shock (Group C). When ferrite chip beads are tested in accordance with 4.6.9, there shall be no evidence of mechanical damage and the impedance shall not change by more than 10 percent. 3.6.9 Vibration (Group C). When ferrite

37、chip beads are tested in accordance with 4.6.10, there shall be no evidence of mechanical damage and the impedance shall not change by more than 10 percent. 3.6.10 Low Temperature Operation (Group C). When ferrite chip beads are tested in accordance with 4.6.12, they shall not open circuit and the D

38、C resistance shall not change by more than 10 percent. 3.6.11 Life (1000 Hours, Group C). When ferrite chip beads are tested in accordance with 4.6.13, they shall not open circuit and the impedance and DC resistance shall not change by more than 20 percent. The DC resistance shall not exceed the max

39、imum value specified in table I. 3.6.12 Resistance to Soldering Heat. When ferrite chip beads are tested in accordance with 4.6.11, there shall be no mechanical damage and the DC resistance and impedance shall not change by more than 10 percent. 3.6.13 Solderability. Ferrite chip beads shall meet th

40、e requirements specified in MIL-STD-202, Method 208. 3.6.14 Salt Spray (Group C). When ferrite chip beads are tested in accordance with 4.6.17, there shall be no evidence of excessive corrosion. Excessive corrosion is defined as that which interferes with electrical or mechanical performance. There

41、shall be no warping or cracking of the ferrite body and the impedance shall not change by more than 10 percent. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03024 R

42、EV B PAGE 8 3.6.15 Outgassing. When ferrite chip beads are tested in accordance with 4.6.18, the materials shall meet the following requirements: a) Total mass loss (TML) Shall not exceed 1.0 percent. b) Collected volatile condensable material (CVCM) Shall not exceed 0.1 percent. Note: This requirem

43、ent can be met by certification of materials, once product has been tested by an approved facility. 3.6.16 Thermal Shock 100 Cycle (Group C). When ferrite chip beads are tested in accordance with 4.6.20, there shall be no mechanical damage and the impedance shall not change by more than 20 percent.

44、3.6.17 Resistance to Solvents. When ferrite chip beads are tested in accordance with 4.6.21, there shall be no mechanical damage. 3.7 Qualification. Qualification for this part is not required. 3.8 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally

45、preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.9 Certificate of compliance. A certificate of compliance shall be required from manu

46、facturers requesting to be an approved source of supply. 3.10 Marking. Marking of the ferrite chip bead is not required; however, each unit package shall be marked in accordance with MIL-STD-1285 and include the PIN as specified herein (see 1.2), the manufacturers name or Commercial and Government E

47、ntity (CAGE) code, and lot date code. 3.11 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of transformer components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by ma

48、ss (see 6.3). 3.12 Manufacturer eligibility. To be eligible for listing as an approved source of supply, the manufacturer shall be listed on the MIL-PRF-27 qualified products list for at least one part or perform the group B and group C inspections specified herein on a sample agreed upon by the manufacturer and DLA Land and Maritime-VA. 3.13 Workmanship. Ferrite chip beads shall be free of defects that will affect usable life or reliability. 4. VERIFICATION 4.1 Classification of Inspection. The insp

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